Method and Apparatus for Integrating Spark Gap Into Semiconductor Packaging
Copyright © Targeted News Service 2024
2024-04-02
ALEXANDRIA, Virginia, April 2 -- An inventor from Reno, Nevada, John Othniel McDonald has been awarded a patent (No. US 11948934 B2, initially filed June 16, 2022) for "Method and apparatus for integrating spark gap into semiconductor packaging." . . .