Methods of Forming Conductive Pipes Between Neighboring Features, and Integrated Assemblies Having Conductive Pipes Between Neighboring Features
Copyright © Targeted News Service 2024
2024-04-02
ALEXANDRIA, Virginia, April 2 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11948984 B2, initially filed Jan. 23, 2023) developed by four inventors Ahmed Nayaz Noemaun, Boise, Idaho; Stephen W. Russell, Boise, Idaho; Tao D. Nguyen, Boise, Idaho; and Santanu Sarkar, Boise, Idaho, for "Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features." . . .