Methods for Forming Hermetically-Sealed Packages Including Feedthrough Assemblies
Copyright © Targeted News Service 2024
2024-04-02
ALEXANDRIA, Virginia, April 2 -- MEDTRONIC, INC., Minneapolis, Minnesota has been assigned a patent (No. US 11950387 B2, initially filed Oct. 19, 2020) developed by David A. Ruben, Mesa, Arizona, for "Methods for forming hermetically-sealed packages including feedthrough assemblies." . . .