Sunday - June 2, 2024

Forging Heads and Fixing Devices With Aligned Through-Holes and Cavities

2024-04-02

ALEXANDRIA, Virginia, April 2 -- GENERAL ELECTRIC COMPANY, Schenectady, New York has been assigned a patent (No. US 11945032 B2, initially filed Dec. 21, 2018) developed by six inventors Hai Chang, Shanghai, China; Dalong Zhong, Shanghai, China; Yingna Wu, Shanghai, China; Yong Wu, Shanghai, China; Zirong Zhai, Shanghai, China; and Yifeng Wang, Shanghai, China, for "Forging heads and fixing devices with aligned through-holes and cavities." . . .

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Forging Heads and Fixing Devices With Aligned Through-Holes and Cavities

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