Semiconductor Chip Package and Method of Assembly
Copyright © Targeted News Service 2024
2024-04-02
ALEXANDRIA, Virginia, April 2 -- LITTELFUSE, INC., Chicago, Illinois has been assigned a patent (No. US 11948878 B2, initially filed Sept. 8, 2022) developed by Stefan Steinhoff, Somerset, United Kingdom, for "Semiconductor chip package and method of assembly." . . .