Sunday - June 2, 2024

Integrated Assemblies and Methods of Forming Integrated Assemblies

2024-04-02

ALEXANDRIA, Virginia, April 2 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11950416 B2, initially filed Feb. 1, 2021) developed by three inventors Alyssa N. Scarbrough, Boise, Idaho; John D. Hopkins, Meridian, Idaho; and Jordan D. Greenlee, Boise, Idaho, for "Integrated assemblies and methods of forming integrated assemblies." . . .

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Integrated Assemblies and Methods of Forming Integrated Assemblies

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