Stacked Die Modules for Semiconductor Device Assemblies and Methods of Manufacturing Stacked Die Modules
Copyright © Targeted News Service 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11942430 B2, initially filed July 12, 2021) developed by Jong Sik Paek, Taichung, Taiwan, for "Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules." . . .