Semiconductor Interconnect Structures With Vertically Offset Bonding Surfaces, and Associated Systems and Methods
Copyright © Targeted News Service 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11942444 B2, initially filed Feb. 13, 2023) developed by Kyle K. Kirby, Eagle, Idaho, for "Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods." . . .