Sunday - June 2, 2024

Systems and Methods for Reducing the Size of a Semiconductor Assembly

2024-03-26

ALEXANDRIA, Virginia, March 26 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11942460 B2, initially filed Dec. 29, 2020) developed by five inventors Hong Wan Ng, Singapore, Singapore; Kelvin Tan Aik Boo, Singapore, Singapore; Chin Hui Chong, Singapore, Singapore; Hem P. Takiar, Fremont, California; and Seng Kim Ye, Singapore, Singapore, for "Systems and methods for reducing the size of a semiconductor assembly." . . .

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Systems and Methods for Reducing the Size of a Semiconductor Assembly

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