Silver Sintering Preparation and the Use Thereof for the Connecting of Electronic Components
Copyright © Targeted News Service 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau, Germany has been assigned a patent (No. US 11938543 B2, initially filed April 9, 2021) developed by three inventors Ly M. Chew, Bruchkobel, Germany; Gregory Berube, Nashua, New Hampshire; and Seigi Suh, Chesterbrook, Pennsylvania, for "Silver sintering preparation and the use thereof for the connecting of electronic components." . . .