Sunday - June 2, 2024

High Power Device Fault Localization via Die Surface Contouring

2024-03-26

ALEXANDRIA, Virginia, March 26 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 11940271 B2, initially filed Nov. 17, 2020) developed by six inventors David J. Lewison, LaGrangeville, New York; Jay A. Bunt, Esopus, New York; Frank L. Pompeo, Redding, Connecticut; Richard Walter Oldrey, Clintondale, New York; John D. Sylvestri, Poughkeepsie, New York; and Phong T. Tran, Highland, New York, for "High power device fault localization via die surfac . . .

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High Power Device Fault Localization via Die Surface Contouring

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