Method for Manufacturing Semiconductor Structure
Copyright © Targeted News Service 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, Taiwan has been assigned a patent (No. US 11942376 B2, initially filed Aug. 8, 2022) developed by five inventors Chun Hsiung Tsai, Hsinchu County, Taiwan; Cheng-Yi Peng, Taipei, Taiwan; Ching-Hua Lee, Hsinchu, Taiwan; Chung-Cheng Wu, Hsin-Chu County, Taiwan; and Clement Hsingjen Wann, Carmel, New York, for "Method for manufacturing semiconductor structure." . . .