Coated Metal Alloy Substrate With at Least One Chamfered Edge and Process for Production Thereof
Copyright © Targeted News Service 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, Texas has been assigned a patent (No. US 11939677 B2, initially filed June 11, 2019) developed by three inventors Kuan-Ting Wu, Taipei, Taiwan; Chi Hao Chang, Taipei, Taiwan; and Hsing-Hung Hsieh, Taipei, Taiwan, for "Coated metal alloy substrate with at least one chamfered edge and process for production thereof." . . .