New York, California Inventors Develop Electronic Package Making Method
Copyright © Targeted News Service 2007
2007-08-03
ALEXANDRIA, Va., Aug. 3 -- David L. Thomas of Endicott, N.Y., and Charles G. Woychik of San Jose, Calif., have developed an electronic package making method.
An abstract of the invention, released by the U.S. Patent & Trademark Office, said: "A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form pa . . .
An abstract of the invention, released by the U.S. Patent & Trademark Office, said: "A method of making an electronic package is described, wherein a substrate is provided with a pattern of conductive pads and a portion of solder positioned on selected ones of the pattern of copper pads. The solder is then reflowed to form pa . . .
