Wednesday - November 20, 2019
Akustica Assigned Patent for Corrugated Package for Microelectromechanical System (MEMS) Device
Copyright © Targeted News Service, 2019
2019-10-19
ALEXANDRIA, Va., Oct. 19 -- Akustica, Pittsburgh, Pennsylvania, and Robert Bosch GmbH, Stuttgart, Germany, have been assigned a patent (No. 10,442,683, initially filed April 14, 2016) developed by Kuldeep Saxena, Sewickley, Pennsylvania, for a "corrugated package for microelectromechanical system (MEMS) device."

The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=10 . . .

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