Wednesday - November 20, 2019
Akustica Assigned Patent for Corrugated Package for Microelectromechanical System (MEMS) Device
Copyright © Targeted News Service, 2019
ALEXANDRIA, Va., Oct. 19 -- Akustica, Pittsburgh, Pennsylvania, and Robert Bosch GmbH, Stuttgart, Germany, have been assigned a patent (No. 10,442,683, initially filed April 14, 2016) developed by Kuldeep Saxena, Sewickley, Pennsylvania, for a "corrugated package for microelectromechanical system (MEMS) device."

The full-text of the patent can be found at . . .

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