ALEXANDRIA, Va., Nov. 18 -- D3 Semiconductor, Addison, Texas, has been assigned a patent (9,496,386) developed by two co-inventors for a "device architecture and method for improved packing of vertical field effect devices." The co-inventors are Thomas E. Harrington III, Carrollton, Texas, and Robert Kuo-Chang Yang, Campbell, California.

The patent application was filed on Aug. 3, 2015 (14/817,010). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Par . . .