ALEXANDRIA, Va., July 24 -- 3M Innovative Properties, St. Paul, Minnesota, has been assigned a patent (8,777,654) developed by Chin Hua Lim, Ang Mo Kio, Singapore, for an "electrical engagement apparatus, system and method."

The patent application was filed on Aug. 19, 2013 (13/969,652). The full text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8777654.PN.&OS=PN/877765 . . .