German Research Project 'V3DIM' Lays the Foundations in 3D Design for the Extremely High Frequency Millimeter-Wave Range
March 09, 2011
March 09, 2011
NEUBIBERG, Germany, March 9 -- Infineon issued the following news release:
The "V3DIM" research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range. V3DIM stands for "design for vertical 3D system integration in millimeter-wave applications". Five partners from indu . . .
The "V3DIM" research project lays the foundations for working out the design requirements to develop innovative, highly integrated 3D System-in-Package (SiP) solutions for systems in the extremely high frequency range of 40 to 100 GHz, the so-called millimeter-wave range. V3DIM stands for "design for vertical 3D system integration in millimeter-wave applications". Five partners from indu . . .